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产品详细介绍:

SJ-6000P

 

Product Information
 
 
Feature
 
• Single component
 
• Low viscosity solvent-
 
• Easy to spray `basting brush or dipping`
 
• Fast curing at room temperature or heat cure catalyst
 
• Good adhesion
 
• Transparent
 
• With UV fluorescence agent
 
• excellent dielectric properties
 
• Underwniters Lab: UL746C
 
 
Use
 
 
• rigid / flex circuit boards, various ceramic and hybrid circuit boards, electronic components and other joints.
 
 
Advantage
 
• Fast curing
 
• resistant to moisture and other harsh environments
 
• The vast majority of electronic materials can be bonded
 
 
Telephone 021 -3755737
 
 
Welcome to inquire!

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